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Track 2 Session 4
2:10 to 3:10 p.m. Wednesday,
October 22, 2008
Use Forward Voltage Drop to Monitor Semiconductor Junction Temperature
During Reliability Testing
Semiconductor junction of integrated circuits or high power LEDs are susceptible to early failure due to excessive internal self heating under
certain operating conditions and environments. When running reliability tests (e.g. high temperature operating life tests) without proper thermal
management, the device under test may be over-stressed when the junction temperature is too high and vice versa. Therefore, junction
temperature monitoring is important during reliability life-stress tests to ensure accurate reliability test results. In this presentation, we are using
high power LEDs to demonstrate how forward voltage of LEDs can be used to measure and monitor junction temperature of the LED and
subsequently calculate the thermal resistance of the LED package.
Key Words: Forward voltage drop method, junction temperature, thermal resistance, K-factor calibration, thermal management
EY Siew
ISO Technology Sdn. Bhd. (Subsidiary of Globetronics Technology Bhd.) |
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