Track 2 Session 9

3:00 to 4:00 p.m. Thursday, October 21, 2010

An Application for Assessing Reliability of Wire Bonding in the Semiconductor Industry – Degradation Analysis of Wire Pull Testing

Degradation analysis is an important data analysis technique for projecting failure data from the degradation history of a quality or performance characteristic that is associated with the reliability of a product. This approach typically requires that the degradation be measured for multiple units over time. However, in some cases, destructive testing such as Wire Pull Test in Chip packaging industry is necessary to obtain degradation measurements and taking multiple measurements over the life of the same unit is therefore not feasible. This article describes an approach, using Weibull++ 7 and ALTA 7, to handle such a data analysis problem and predict a failure distribution model.

Key Words: Wire Bonding, Semiconductor Industry, Degradation Analysis, Wire Pull Testing

Bryan Liang

ReliaSoft Asia

 

Lee Chai Ying

Infineon Technologies