Track 2 Session 2
10:30 to 11:30 a.m. Wednesday April 7, 2010
Stress Interaction Model – Modelling the Interactions of Multiple Types of Stress to a Device Under Test
In an experiment, temperature cycles (TC) and temperature humidity bias (THB) stresses were applied sequentially to semiconductor devices. The failure rate varied significantly with the order in which the stress was applied.
The stress interaction model describes this behaviour. The sequence of the two stressors is set up as a curve in R2 and the failure rate as a vector field. Based on its divergence or rotation, it results in a multiplicative or additive failure rate model. The survival function is parametrized by a path integral over a non-conservative vector field, so that it contains the stress history as well.
Key Words: Reliability Model, Risk Assessment, Interaction of Two Stressors
Horst Lewitschnig
Infineon Technologies Austria AG
Austria